Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Polymer Name
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Product Highlights
A New Level of Workability
Designers can now specify BMI in structures with extreme curvature without performance worries because HexPly® F650 offers excellent tack, handling characteristics, and straightforward layup and processing. In addition, there is no unpleasant odor and no need for cumbersome layup aids.
Longer Out Time
You have more time to work with HexPly® F650. The out time for successful structure layup is measured in weeks rather than days. And that’s time that allows for more complex applications.
Straight-Up Curing
You won’t have to babysit HexPly® F650. Employ simple, straight-up cure cycle followed by conventional postcure and that’s it. HexPly® F650’s unique resin chemistry also eliminates micro-cracking. HexPly® F650 delivers consistent void-free laminates time after time.
Superior Burn Characteristic
HexPly® F650 takes the heat, remaining structurally stable up to 600°F (316°C) dry, and 450°F (232°C) wet. It emits minimal visual smoke and possesses excellent fire barrier properties. HexPly® F650 is currently being evaluated for a variety of fire containment structures.
Desirable Electrical Performance
HexPly® F650 possesses excellent electrical properties, characteristic to polyimide resin systems, and is the ideal candidate for radome and other electronic applications.
- Hexcel BMI capability
- Background
- Introduced first BMI prepreg to industry (1970)
- Synthesized base BMI monomer
- 20-Year production history
- New more optimum BMI (HexPly® F650) introduced in 1985 Copyright
- Advantages
- Viscous, homogeneous
- Simple, adjustable, reaction kinetics
- No resin advancement at room temperature
- Simple processing and impregnation
- High Tg relative to post cure
- Dimensionally stable at greater than 500°F (260°C)
- High laminate mechanical strengths and strains
- Modest cost
- Non-micro cracking for woven laminates
Applications & Uses
Properties
- Physical Form
- Neat Resin Properties
Value Units Test Method / Conditions Specific gravity 1.27 - - Tg (Dry) min. 600 (316) °F (°C) - Equilibrium moisture absorption 4.3 % - Fracture Toughness, K1C 0.51 (0.46) ksi (Mpa) - Strain energy release rate, G1C 0.38 (0.067) in-lb/in2 (KJ/m2) - Linear Coefficient of Thermal Expansion 2.7 x 10–5 (4.9 x 10–5) in/in/°F (cm/cm/°C) - Gel time at 350°F (177°C) min. 5-8 - -
Storage & Handling
- Storage
HexPly® F650 prepreg should be sealed in a polyethylene bag and refrigerated, preferably below 32°F (0°C). Following removal from refrigerated storage, allow the prepreg to reach room temperature before opening the polyethylene bag to avoid moisture condensation.
Shelf life: 12 months at 0°F (–18ºC), 6 months at 40°F (4ºC) (maximum, from date of manufacture).- Product Handling and Safety
Hexcel recommends that customers observe established precautions for handling polyimide resins and fine fibrous materials. Operators working with this product should wear clean, impervious gloves to reduce the possibility of skin contact and to prevent contamination of the material.