Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Product Applications
This compound is designed for encapsulation of hybrids, mica capacitors and other semi conductor grade devices requiring very high purity and optimum moisture performance. It is an ideal candidate for chip on board applications due to its excellent adhesion characteristics.
Properties
- Physical Form
- Thermal Properties
Value Units Test Method / Conditions Glass Transition Temperature (Tg) 160.0 °C - Linear Thermal Expansion 38 x 10⁻⁶ cm/cm/°C - Plate Flow (at 150 °C ,60° angle) 35.0 mm - Hot Plate Gel Time (at 150 °C) 45.0 seconds - - Electrical Properties
Value Units Test Method / Conditions Dissipation Factor (1 KHz) 0.005 - ASTM 150 Dielectric Constant (1 KHz) 3.5 - ASTM 150 Dielectric Strength 900.0 volts/mil ASTM 149 Loss Factor (1 KHz) 0.018 - ASTM 150 - Powder Characteristics
Value Units Test Method / Conditions Particle Size (U.S. Mesh, +80 max) 1.0 % - Particle Size (U.S. Mesh, -325) 27 - 33 % - Application and Cure Range 125 - 175 °C - Cure Time (at 130°C ) 60.0 minutes - Cure Time (at 150°C ) 30.0 minutes - Edge Coverage 35.0 % ASTM D-2967 Molded Density 1.41 gm/cc - - Moisture Properties
Value Units Test Method / Conditions Water Absorption (at 23 °C, 24 hours) 0.7 % -
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life 4 °C , months 6