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Value Units Test Method / Conditions Tensile Strength (MD) 65 Kpsi - Tensile Strength (CD) 49 Kpsi - Peel Strength to Copper (1 oz/35 micron) After Thermal Stress 7.1 (1.2) lb/in (N/mm) IPC TM-650 2.4.8 Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures 7.1 (1.2) lb/in (N/mm) IPC TM-650 2.4.8.2 Peel Strength to Copper (1 oz/35 micron) After Process Solutions 7.1 (1.2) lb/in (N/mm) IPC TM-650 2.4.8 Young's Modulus 4.1 (28.2) Mpsi (GPa) IPC TM-650 2.4.18.3 Poisson's Ratio 0.18 - ASTM D-3039 - Physical Properties
Value Units Test Method / Conditions Specific Gravity 1.65 - ASTM D 792 Water Absorption (0.062) 0.27 % IPC TM-650 2.6.2.1 - Thermal Properties
Value Units Test Method / Conditions Glass Transition Temperature (Tg) - TMA 250 °C IPC TM-650 2.4.24 Coefficient of Thermal Expansion (X,Y) 16 ppm/°C IPC TM-650 2.4.41 Coefficient of Thermal Expansion (Z) - Below Tg 48 ppm/°C IPC TM-650 2.4.24 Coefficient of Thermal Expansion (Z) - Above Tg 150 ppm/°C IPC TM-650 2.4.24 z-axis Expansion (50-260oC) 1 % IPC TM-650 2.4.24 Decomposition Temperature (Td, 5%) 407 °C IPC TM-650 2.3.41 Decomposition Temperature (Td) - Initial 387 °C IPC TM-650 2.3.41 T260 min. 60 min IPC TM-650 2.4.24.1 T288 min. 60 min IPC TM-650 2.4.24.1 T300 min. 60 min IPC TM-650 2.4.24.1 Thermal Conductivity 0.25 W/m/K - - Electrical Properties
Value Units Test Method / Conditions Electrical Strength 1451 (57.1) Volts/mil (kV/mm) IPC TM-650 2.5.6.2 Dielectric Constant (1 MHz) 4.2 - ASTM D 150 Dielectric Constant (1 GHz) 4 Multilayer ~ 50% RC IPC TM-650 2.5.5.9 Dissipation Factor (1 MHz) 0.01 - ASTM D 150 Volume Resistivity (C96/35/90) 1.5 x 10^8 MΩ-cm IPC TM-650 2.5.17.1 Volume Resistivity (E24/125) 3.0 x 10^8 MΩ-cm IPC TM-650 2.5.17.1 Surface Resistivity (C96/35/90) 1.6 x 10^9 MΩ IPC TM-650 2.5.17.1 Surface Resistivity (E24/125) 1.6 x 10^8 MΩ IPC TM-650 2.5.17.1 Dielectric Breakdown min. 41 kV IPC TM-650 2.5.6 Arc Resistance 143 sec ASTM D495 - Flammability
Value Units Test Method / Conditions Flammability HB - UL 94
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