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Applied Technologies 5921 Silver Epoxy

Applied Technologies 5921 Silver Epoxy is a highly flexible, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and cure responses at either room temperature (20-25°C) or low heat (100°C). Applications include making and/or repairing flexible circuitry on a variety of plastic substrates including both raw and Indium Tin Oxide coated polyester films. Other uses include chip bonding, die attachment, and solderless wire connections. This material when properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack resistant - even when creased at 180°C.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Compatible Substrates & Surfaces: Plastics

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
2K (2 component) Adhesive,
Epoxy Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Other Adhesives & Sealants
Components

(2) Part A - Epoxy/Silver Part B - Hardener/Silver

Consistency

Viscous, Thixotropic Paste

Features & Benefits

Ready-to-Use Product Features
Crack Resistant,
Easier Processing,
Easy To Finish,
Electrically Conductive,
Fast Cure,
Good Adhesion,
Highly Flexible,
Low Temperature Curing

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Compatible Substrates & Surfaces
Plastics
Applications
  • Making and/or repairing flexible circuitry
  • Chip bonding
  • Die attachment 
  • Solderless wire connectrions
Instructions
  1. Be sure that all surfaces to be bonded or coated with 5921 silver epoxy are clean, dry, and free of any grease or oil.
  2. Thoroughly mix equal amounts (by weight or volume) of Part-A and Part-B. Typical mixing times for small batches up to 10 grams is approximately 2 minutes.
  3. Since 5921 silver epoxy is designed to be cured at room temperature (25°C) or with low heat, it is recommended that applications be made within 2-3 hours of mixing. After this time the material will exhibit drastic increases in viscosity.
  4. For cleanup of uncured material use isopropyl alcohol.
Curing Schedule

24-36 Hours at 25°C or 15 Minutes at 80-100°C

Mix-Ratio

1:1 (by weight or volume)

Pot Life

2-3 Hours at 20-25°C (3-5 gm mass)

Properties

Color
Silver
Typical Properties
ValueUnitsTest Method / Conditions
Silver Content85.0%-
Specific Gravity4.1--
Volume Resistivitymax. 0.001ohm-cm-
Thermal Conductivity (in/F² hr °F)10.0BTU-
Tensile Lap Shearmin. 800psi-
Service Temperature Range-55 - (+)80°C-

Storage & Handling

Shelf Life

(2) months sealed, at room temperature (25°C), unmixed.