Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Tacky, Non Curing.
- Pressure Sensitive.
- High Thermally Conductive.
- Electrically Insulating.
- Film Adhesive.
- Component Attach.
- Heat Sink Attach.
- Substrate Attach.
Applications & Uses
- Markets
- Applications
- Application Area
- Application Procedures
- Cut or pre-cut to desired size.
- Remove one side of release paper from adhesive.
- Place on substrate or component with rolling finger pressure, then remove the other release paper.
- Place component on substrate with insertion pressure of 15 psi or more.
Properties
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity (at 25°C, 1minute) min. 1x10¹⁴ Ω-cm - Dielectric Strength min. 750 Volts/mil - Glass Transition Temperature -60.5 to -49.5 °C - Lap Shear Strength min. 0.69 N/mm² - Device Push Off Strength 1.26 - 1.54 N/mm² - Hardness 36 - 44 Shore A - Cured Density 1.98 - 2.42 g/cc - Thermal Conductivity 10.26 - 12.54 W/m-°C - Coefficeint of Linear Thermal Expansion 93.5 - 126.5 ppm/°C - Maximum Continuous Operation Temperature max. 150 °C -
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards
Packaging & Availability
- Product Availability
- TP7209 is a low bond strength thermoplastic film adhesive. It isdesigned for bonding heat-sink, component, and substrate.
- This unique diamond filled material has excellent thermal conductivity and is tacky at room temperature.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)