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AI Technology RTK 7659

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

Product Type: Insulation Adhesive

Application Area: Die/Chip Attach

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Product Type
Insulation Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Other Adhesives & Sealants

Features & Benefits

Ready-to-Use Product Features
Electrically Insulating,
Excellent Dielectric Properties,
Excellent Substrate Adhesion,
Good Adhesion,
High Reliability,
Low Glass Transition Temperature,
Low Moisture Absorption,
Low Outgassing,
Low Stress,
Stress-free,
Tacky,
Thermally Conductive
Product Features
  • Stress-free.
  • Tacky epoxy film adhesive.
  • Diamond filled, ultra high.
  • Thermal conductivity.
  • High power die attach.
  • Substrate and component.

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Application Area
Die/Chip Attach
Application Procedures
  • Keep product at room temperature for 15 minutes before using.
  • Cut to desired size. Clean contact surfaces if needed.
  • Remove one side of the release liner by peeling upa corner of the release liner. Fold the release liner over, approaching a 180° angle.
  • Pull the release liner quickly, removing it with one stroke. Apply to substrate, then remove other side of release liner and attach die or component.
  • Cure according to recommended cure schedules.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 30minutes)min. 1x10¹⁴Ω-cm-
Dielectric Strength675 - 825Volts/mil-
Glass Transition Temperature-66 to -54°C-
Lap Shear Strengthmin. 6.9N/mm²-
Device Push Off Strengthmin. 13.8N/mm²-
Hardness76.5 - 93.5Shore D-
Cured Density2.07 - 2.53g/cc-
Thermal Conductivity10.26 - 12.54W/m-°C-
Coefficeint of Linear Thermal Expansion93.5 - 126.5ppm/°C-
Maximum Continuous Operation Temperaturemax. 150°C-

Regulatory & Compliance

Certifications & Compliance
ISO 9001

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
100°C 2 hrs 5 - 10 psi
125°C 1 hr 5 - 10 psi
150°C 30 mins 5 - 10 psi

The die or component can also be tacked on the substrate at 80°C or higher with 5 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

Packaging & Availability

Product Availability
  • RTK7659 is available in reels,sheets, or as custom preforms.
  • Standardthicknesses are 0.003" and 0.006".
  • Special thicknesses are available.
  • This material is a self supporting tacky film adhesive.

Storage & Handling

Shelf Life
1 Year (at 0-5°C)