Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- 100% solid.
- Low temperature curable.
- Fine pitch with extra fine silver.
- Long pot life.
- In line die attach.
- Large and small dies.
- Rapid curing for smaller dies (<10mm).
- Low temperature curing for large dies.
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Thaw to ambient temperature for 30 minutes before opening jar or using syringes.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to one of the recommended cure schedules.
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity (at 150°C, 60minutes) max. 5x10⁻⁴ Ω-cm - Glass Transition Temperature 80 °C - Glass Transition Temperature 72 - 88 °C - Current Carrying Capabilities min. 20 Amp/mm² - Device Push Off Strength min. 16.6 N/mm² - Hardness 72 - 88 Shore D - Cured Density 3.15 - 3.85 g/cc - Thermal Conductivity min. 8.6 W/m-°C - Thermal Conductivity 7.74 - 9.46 W/m-°C - Coefficeint of Linear Thermal Expansion 34 - 46 ppm/°C - Maximum Continuous Operation Temperature max. 150 °C - Pot Life (at 25°C) 7 Days - Viscosity (at 24°C, 5rpm, Spindle CP51, Thixotropic Index=3-5) 12000 - 18000 cPs Brookfield Viscometer DV-1 Electrical Resistivity max. 5x10⁻⁴ Ω-cm - Die Shear Strength min. 2400 psi - Viscosity (at 5 rpm, Thixotropic Index=>4) 15000 cPs -
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 125°C 30 mins 150°C 15 mins 175°C 8 mins
Packaging & Availability
- Product Availability
ME8630-RC is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 Year (at -40°C)
- Storage Information
Storage temperature: -40°C.