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AI Technology ESP 8450-WL

ESP8450-WL is a high melt-flow version of standard ESP8450 designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent flexibility from-55°C to 150°C. The dry, tack-free handling of the film makes it ideal for an automated pick and place assembly and is reworkable from 80°C to 150°C. ESP8450-WL has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

Product Type: Conductive Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach, Stack Chip Packaging

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Chemical Family
Epoxy & Epoxy Derivatives
Product Type
Conductive Adhesive,
Epoxy Adhesive
Technologies
Ready-to-Use Products
Product Families
Ready-to-Use Products — Adhesives & Sealants
Conductive Adhesives

Features & Benefits

Ready-to-Use Product Features
Conductive,
Electrically Conductive,
Flexible,
Good Solvent Resistance,
High Melt Flow,
High Reliability,
Low Glass Transition Temperature,
Low Moisture Absorption,
Low Stress,
Tack-free,
Temperature Resistance
Product Features
  • Tacky-free epoxy film.
  • Electrical conductive adhesive.
  • Moisture-temperature resistant.
  • -60 tg: flexible stress-free.
  • Large area die attach.
  • Mismatched CTE substrate attach.
  • Electrical & thermal ground plane bonding.
  • Wafer lamination and stack-chip bonding.

Applications & Uses

Markets
Consumer Goods,
Electrical & Electronics
Applications
Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants
Electrical & Electronics — Parts & Components
Semiconductor Manufacturing
Application Area
Die/Chip Attach,
Stack Chip Packaging
Application Procedures
  • Let product stay at room temperature for 15 minutes. Remove film from protective paper.
  • Cut to desired size.
  • Place on substrate and cure according to one of the recommended schedules.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 4x10⁻⁴Ω-cm-
Glass Transition Temperature-60°C-
Glass Transition Temperature-45°C-
Device Push Off Strengthmin. 10.3N/mm²-
Hardness82Shore A-
Cured Density3.5g/cc-
Thermal Conductivitymin. 6.0W/m-°C-
Thermal Conductivity6.4W/m-°C-
Coefficeint of Linear Thermal Expansion110ppm/°C-
Maximum Continuous Operation Temperature150°C-
Electrical Resistivitymax. 4x10⁻⁴Ω-cm-
Die Shear Strengthmin. 1500psi-

Regulatory & Compliance

Certifications & Compliance
ISO 9001

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
125°C 2 hrs 8-10 psi
150°C 1 hr 8-10 psi

The die or component can also be tacked on the substrate at 100°C or higher with nominal placement pressure. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

Packaging & Availability

Product Availability

ESP8450-WL is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.

Storage & Handling

Shelf Life
1 Year (at 0-5°C)
Storage Information

Storage temperature: 0- 5°C in sealed package.