Enhanced TDS
Knowde-enriched technical product data sheet
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free.
- One or two component.
- Reworkable.
- Epoxy paste adhesive.
- Large area die.
- Substrate/component.
- Reworkability.
- Solder Replacement.
- Mismatched CTE's.
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Cure Method
- Application Procedures
- Mix adhesive in 1:1 weight. (Note: In kit form, viscosity of Part A > Viscosity of Part B).
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended cure schedules.
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Electrical Resistivity (at 150°C, 60minutes) max. 4x10⁻⁴ Ω-cm - Glass Transition Temperature -22 to -18 °C - Glass Transition Temperature -20 °C - Current Carrying Capabilities 35 Amp/mm² - Lap Shear Strength min. 5.5 N/mm² - Device Push Off Strength min. 10.3 N/mm² - Cured Density 3.6 - 4.4 g/cc - Thermal Conductivity min. 7.9 W/m-°C - Thermal Conductivity 7.11 - 8.69 W/m-°C - Coefficeint of Linear Thermal Expansion 120 ppm/°C - Maximum Continuous Operation Temperature max. 130 °C - Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) 104000 - 156000 cPs Brookfield Viscometer DV-1 Electrical Resistivity max. 4x10⁻⁴ Ω-cm - Die Shear Strength min. 1500 psi - Viscosity (at 0.5 rpm) 129000 cPs -
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 25°C 120 hrs 80°C 8 hrs 100°C 4 hrs 125°C 2 hrs 150°C 1 hr If Part A viscosity increases, it can be lowered using mek, acetone or ipa to get the viscosity needed using a drop or 2 at a time and mix well. It can also be heated up to 50°C to lower the viscosity, Mix well & take amount needed. Allow to cool before mixing with Part B.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: 25°C in original sealed package.