AI Technology EG 8050

EG8050 is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). Post bake at 100°c or 125°c for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing. It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.