Products in Packaging & Assembly: Light Weight

Verkid® BMC PX4 is a fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives. Generally thermoset unsaturated polyester or vynil-ester resins are used as organic matrix. With the aim of enhance its characteristics and improve its transformation, other components are added: catalysts, inhibitors, thermoplastic additives, demoulding agents, thickeners and pigments.

Bipack® is dust and fiber-free, food approved and can be sterilized, which makes it the perfect material for the pharmaceutical, food and electronics industry.

Carbkid® Fiber VE SMC is a polymer composite material reinforced with carbon fiber, which consists of a thermoset resin (usually vinylester or epoxy) and different additives that allow to obtain certain specific characteristics and improve the behavior of the material during the molding process of the final product. While the standard SMC is reinforced with glass fibers, the CSMC is reinforced with cut fibers or carbon fabrics. CSMC materials combine the low-weight characteristics offered by carbon composites in conjunction with a widespread forming process, such as compression molding, which allows for short manufacturing cycles and is therefore suitable for industrial applications in large series.

Verkid® SMC H154 is used in hot press, compression molding for the production of large parts with high mechanical properties and excellent surface finish. It is a glass fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives.

XR61406 is a low density epoxy casting system. product is recommended for reducing weight, when casting and potting small electronic modules. Product is suitable for operating in environments from -40c. to +120c.

CLH6020 is a thermally conductive, two part epoxy system. the system was secifically designed for applications where heat dissipation on thermally sensitive devices is required.