Products in Packaging & Assembly: High Temperature Resistance

DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

SynFoam ELG is a two part closed cell syntactic resin system that is based on epoxy rather than polyurethane chemistry. ELG can withstand continuous exposure up to 300oF and retain it's rigidity. SynFoam ELG has low dielectric loss and dielectric properties. The weight is significantly lower than most low loss materials used for electronic applications. The system is suitable for both electronic potting and encapsulation as well as structural support. SynFoam ELG is shipped as two components which when mixed together can be poured and cast into various shapes and sizes. SynFoam ELG is available in 1 and 5 gallon kit sizes. Each kit contains an A and B side that must be mixed together prior to casting. SynFoam ELG does not require temperature to cure, but requires higher postcure temperatures to reach the maximum service use temperature. Please consult the appropriate instructions prior to using ELG.

Verkid® BMC PX4 is a fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives. Generally thermoset unsaturated polyester or vynil-ester resins are used as organic matrix. With the aim of enhance its characteristics and improve its transformation, other components are added: catalysts, inhibitors, thermoplastic additives, demoulding agents, thickeners and pigments.

Carbkid® Fiber VE SMC is a polymer composite material reinforced with carbon fiber, which consists of a thermoset resin (usually vinylester or epoxy) and different additives that allow to obtain certain specific characteristics and improve the behavior of the material during the molding process of the final product. While the standard SMC is reinforced with glass fibers, the CSMC is reinforced with cut fibers or carbon fabrics. CSMC materials combine the low-weight characteristics offered by carbon composites in conjunction with a widespread forming process, such as compression molding, which allows for short manufacturing cycles and is therefore suitable for industrial applications in large series.

Verkid® SMC H154 is used in hot press, compression molding for the production of large parts with high mechanical properties and excellent surface finish. It is a glass fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives.

SynFoam ELG is a two part closed cell syntactic resin system that is based on epoxy rather than polyurethane chemistry. ELG can withstand continuous exposure up to 300oF and retain it's rigidity. SynFoam ELG has low dielectric loss and dielectric properties. The weight is significantly lower than most low loss materials used for electronic applications. The system is suitable for both electronic potting and encapsulation as well as structural support. SynFoam ELG is shipped as two components which when mixed together can be poured and cast into various shapes and sizes. SynFoam ELG is available in 1 and 5 gallon kit sizes. Each kit contains an A and B side that must be mixed together prior to casting. SynFoam ELG does not require temperature to cure, but requires higher postcure temperatures to reach the maximum service use temperature. Please consult the appropriate instructions prior to using ELG.

PLASTICYL™ PEEK1001 is a conductive masterbatch based on Poly Ether Ether Ketone (PEEK) loaded with 10% of Nanocyl’s MWCNTs (NC7000™). Because of its low viscosity and high flow, PLASTICYL™ PEEK1001 is ideal for injection molding and extrusion processes.