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Adhesives & Sealants
Products in Adhesives & Sealants
963 Products found in Adhesives & Sealants
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EpoxySet Inc.
EPOXIBOND™ EB-135LP
Product Type:
Adhesive, 2K (2 component) Adhesive
Application Area:
Electrical Components, Optical Applications, Electronic Components, Optoelectronics Devices, Semiconductors, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Metal, Glass, Wood, Plastics
Cure Method:
Air Dry, Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).
Novum Glass LLC.
Novum Glass U-355
Functions:
Filler
U-355 used in a variety of industries for maintaining a consistent space between objects, allowing for more repeatable results and fewer rejected parts.
CoolMag Thermo Conductive, S.L.
COOLMAG™ 29
Applications:
Batteries, Sensors & Actuators, Electrical & Electronic Systems
Product Families:
Encapsulants, Adhesives & Sealants
CoolMag™ 29 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
EpoxySet Inc.
EpoxySet Inc. TG-61
Product Type:
Grease
Application Area:
Semiconductors
Features:
Soft, Thermally Conductive, Good Thermal Conductivity, Low Vent Bleed, Long Term Protection, Good Stability
TG-61 is Non-Silicone thermal grease is exceptionally soft, non-silicone thermal grease. In addition to solving the problems of contamination and migration associated with traditional silicone-based thermal grease, this unique material can be spread into an extremely thin film while remaining a homogenous mixture.
EpoxySet Inc.
FLASHBOND™ UV-8701E
Product Type:
Epoxy Adhesive
Application Area:
Electronic Components
Compatible Substrates & Surfaces:
Glass, Plastics, Ceramic, Metal
Chemical Family:
Epoxy & Epoxy Derivatives
SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.
AI Technology
AI Technology ESP 7450
Applications:
Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
Creative Global Services
CGSTAPE - 8257S
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
Chemical Family:
Silicones
CGSTAPE - 8257S is a polyimide backing and silicone adhesive offers ex- cellent chemical and thermal resistance with excellent electrical insulating properties.
AI Technology
AI Technology ME 8630-DA
Applications:
Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.
AI Technology
AI Technology EG 8020
Applications:
Adhesives & Sealants, Appliances & Electronics, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EG8020 is a two-part, silver filled, room temperature curable adhesive upon mixing. This paste has good bond strength and is both electrically and thermally conductive. The easy mix ratio of 1:1 by weight or volume and ambient curable with long pot-life enable the adhesive to be used for small volume field and larger volume production applications.
Suncolor Corporation
SUNSPHERES™ 200 Nm ST-3
Functions:
Reinforcement, Filler
Chemical Family:
Silica, Carbonates
End Uses:
Radiation Curable Coating, Primer, Waterborne Coating, Marine Applications, Top Coat, Lighting Applications, Solventless & High Solids Coating, Aerospace Applications
The Sunspheres™ 200 Nm ST- 3 are surface treated*, optically clear, solid fused amorphous microspheres designed for optimum dispersion in coatings, inks, adhesives, and thermoplastics, including UV curable compositions. Cured films show enhanced physical and mechanical properties including increased corrosion resistance, reduced shrinkage, improved adhesion, and enhanced surface qualities such as mar and scratch resistance. This product is particularly useful in improving impact resistance. The average particle size is 200 nanometers and range in size from 50 to 500 nm.
EpoxySet Inc.
EpoxySet Inc. STG-51TC
Product Type:
Conductive Grease
Application Area:
Semiconductors, Power Modules
Features:
High Temperature Resistance, Good Thermal Stability, Thermally Conductive, High Dielectric Strength, Good Thermal Conductivity, Filled, Low Vent Bleed, Non-Toxic
Chemical Family:
Silicones
STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation
AI Technology
AI Technology MC 7686-UF
Applications:
Adhesives & Sealants, Appliances & Electronics, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
AI Technology
AI Technology MC 7883
Applications:
Transportation Assembly, Appliances & Electronics, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
AI Technology
AI Technology MC 7865-GT
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Encapsulants, Adhesives & Sealants
Palm Labs Adhesives
Turbo Fuse Series 120 - Low Odor/Low Bloom
Product Type:
1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Metal, Elastomers & Rubbers, Aluminum, Steel
Chemical Family:
Cyanoacrylates
Features:
High Performance, Low Odor, Fast Curing, Good Wicking, Low Blooming
Turbo Fuse Series 120 - Low Odor/Low Bloom advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse is ideal for use in applications that require good "wicking" characteristics and/or in close fitting applications. The Low Odor/Low Bloom formula is widely used in the Aerospace, Automotive and Electronic industries.
EpoxySet Inc.
EpoxySet Inc. HTG-72
Product Type:
Grease
Application Area:
Semiconductors
Features:
High Temperature Resistance, Improved Heat Transfer Efficiency, Good Thermal Conductivity, Filled, Low Vent Bleed, Long Term Protection, High Temperature Strength, Good Stability
HTG-72 – is our highest temperature resistance thermal grease, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
AI Technology
AI Technology EG 9090
Applications:
Adhesives & Sealants, Appliances & Electronics, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
AI Technology
AI Technology RTK 7559-LB
Applications:
Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
AI Technology
AI Technology EDC 9260
Applications:
Adhesives & Sealants, Appliances & Electronics, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
Novum Glass LLC.
Novum Glass U-106
Functions:
Filler
Synonyms:
Glass, oxide, chemicals, Oxide glass chemicals
U-106 used in a variety of industries for maintaining a consistent space between objects, allowing for more repeatable results and fewer rejected parts.
Creative Global Services
CGSTAPE - 7658 (1mil)
Ready-to-Use Product Type:
Tape
Application Area:
Traction Motors, Power Transformers, Automotive Starter/Generator Parts, Machine Parts
Features:
Electrically Insulating, Corona Resistant
CGSTAPE - 7658 (1mil) is a CGS polyimide film was developed specifically to withstand the damaging effects of “corona,” which can cause ionization and eventual breakdown of an insulation material or system when the voltage stress reaches a critical level.
AI Technology
AI Technology ME 8630-RC
Applications:
Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.
Palm Labs Adhesives
Turbo Fuse Series 160
Product Type:
1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Aluminum, Steel, Metal, Elastomers & Rubbers
Chemical Family:
Cyanoacrylates
Features:
High Viscosity, High Performance, General Purpose, Fast Curing, Ease of Handling
Turbo Fuse Series 160 advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 160 is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.
AI Technology
AI Technology ME 7857-SC
Applications:
Consumer Electronics, Equipment & Parts, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.
AI Technology
AI Technology ESP 7666-FOW
Applications:
Appliances & Electronics, Semiconductor Manufacturing, Printed Circuit Boards (PCBs)
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.
AI Technology
AI Technology ESP 7679-LB
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
EpoxySet Inc.
EPOXIBOND™ EB-119M
Product Type:
Adhesive, 2K (2 component) Adhesive, Potting Compound
Application Area:
Semiconductor Die Attach, Optical Applications, Electronic Components, Optoelectronics Devices, Interconnect, Photonic Devices, Medical Applications, Medical Devices
Compatible Substrates & Surfaces:
Metal, Glass, Wood
Cure Method:
Air Dry, Heat Cure
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.
AI Technology
AI Technology ME 7159
Applications:
Semiconductor Manufacturing, Adhesives & Sealants, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.
AI Technology
AI Technology ME 8650-RCT
Applications:
Semiconductor Manufacturing, Appliances & Electronics, Advanced Materials
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
EpoxySet Inc.
EpoxySet Inc. TG-69
Product Type:
Thermal Grease
Application Area:
TV Sets, Coils, Relays, Rectifiers, Amplifiers, Semiconductors
Features:
Thermally Conductive, High Dielectric Strength, Improved Heat Transfer Efficiency, Good Thermal Conductivity, Low Vent Bleed, Low Creep, High Temperature Strength
TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.
EpoxySet Inc.
EPOXIBOND™ EB-155
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Encapsulant, Adhesive, Epoxy Adhesive, Potting Compound
Cure Method:
Air Dry, Heat Cure
Application Area:
Electronic Components, Fiber Optic Cables, Medical Applications, Optoelectronics Devices
Compatible Substrates & Surfaces:
Plastics, Metal
EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.
Palm Labs Adhesives
Turbo Fuse Series 170
Product Type:
1K (1 component) Adhesive
Compatible Substrates & Surfaces:
Aluminum, Steel, Metal, Elastomers & Rubbers
Chemical Family:
Cyanoacrylates
Features:
High Viscosity, High Performance, General Purpose, Fast Curing, Ease of Handling
Turbo Fuse Series 170 advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 170 is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.
EpoxySet Inc.
EpoxySet Inc. STG-41
Product Type:
Conductive Grease
Application Area:
TV Sets, Electrical Components, Relays, Rectifiers, Amplifiers, Semiconductors, Coils, Power Modules
Features:
Soft, Low Flow, Good Thermal Conductivity, Thermally Conductive, Low Vent Bleed, Non-Toxic
Chemical Family:
Silicones
STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.
Novum Glass LLC.
Novum Glass U-75
Functions:
Filler
Synonyms:
Glass, oxide, chemicals, Oxide glass chemicals
U-75 used in a variety of industries for maintaining a consistent space between objects, allowing for more repeatable results and fewer rejected parts.
Bomar Specialties LLC
Bomar Oligomers® BR-641D
Applications:
Potting Compounds, Electronics Coatings, Adhesives & Sealants
Product Families:
Oligomers, Monomers & Intermediates
Chemical Family:
Urethane Acrylate/Isocyanate
Bomar™ BR-641D is a Polybutadiene (PBD) urethane acrylate, which was designed to meet rigorous electronic coating applications. This oligomer has exceptional adhesion to various metals, glass,and polycarbonate substrates. BR-641D has many desirable properties that are typical to PBD resins, combined with radiation curability. In applications requiring thermal cycling resistance, BR-641D withstands the extremes of temperature typical of such tests, without undue degradation of properties. In addition to the adhesion properties listed in the table below, BR-641D showed excellent adhesion to PMMA, ABS, PVC, Nylon-6, Polystyrene,and Polypropylene.
AI Technology
AI Technology ME 8456-DA
Applications:
Adhesives & Sealants, Appliances & Electronics, Automotive Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
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