Products in Adhesives & Sealants: Epoxy & Epoxy Derivatives

ALBIDUR® VE 3940 is a concentrated dispersion, comprising 40% high-performance elastomer within a Bisphenol A epoxy vinyl ester resin. This product serves the essential purpose of enhancing the toughness of vinyl ester resins that would otherwise be brittle. The elastomeric component in use is a specialized silicone rubber, meticulously distributed within the liquid resin as a finely dispersed second phase.

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

ARCOR® Arcthane is a high elongation, elastomeric hybridized epoxy/urethane compound. This versatile product is specifically designed for expansion joint sealing and crack repair applications, offering excellent compatibility with epoxy coatings. The urethane component imparts toughness and flexibility, allowing for resilience in demanding conditions. Meanwhile, the epoxy aspect enhances water and chemical resistance, as well as shelf stability. ARCOR® Arcthane's unique formulation eliminates the moisture sensitivity and toxicity commonly associated with traditional urethanes, thanks to its epoxy reactivity. With its light paste consistency, this product can be easily applied using a squeegee or caulk gun, with the added benefit of being able to achieve thicknesses of up to 500 mils without slumping. Choose ARCOR® Arcthane for its outstanding sealing and repair capabilities, compatibility with epoxy coatings, and the enhanced properties of both epoxy and urethane components, ensuring durable and reliable performance in expansion joint and crack repair applications. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

Fast Set Epoxy 8332 is a quick-set 2-part epoxy adhesive. Bonded parts need only be held together for eight to ten minutes before handling. It offers excellent adhesion to a wide range of materials that are difficult to bond with, including glass, fiberglass, concrete, ceramics, woods, and most metals and plastics. This is a general-purpose adhesive suitable for household, industrial and manufacturing applications.

Andisil® 186 Silane is used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

Epoxy functional silane used used to improve dry and wet strength in cured composites reinforced with glass fiber rovings. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EPOXIBOND™ EB-119M is a two component, low viscosity, heat cure epoxy designed for high temperature applications. It is especially well suited to fiber optic terminating, where optical fibers are "pot and polished" into connectors or ferrules.

Glycidoxy (epoxy) -functional silane that is used as a coupling agent for unsaturated polyester– fiberglass composites, polysulfide & polyurethane caulks and sealants, and glass roving size-binders. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.

EPOXIBOND™ EB-135 is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

LEEBOND 37-75 is a proprietary two-part epoxy adhesive used in both electrical-grade potting and structural adhesive applications. Cured systems demonstrate excellent toughness, impact resistance and exceptional bond strength for hard to bond to substrates. This system can be cured at both room temperature or accelerated with modest heating.

Vosschemie Benelux SL Epoxy Filler Universal Gray A+B is a 2-component epoxy finishing putty for filling irregularities and holes in polyester, epoxy or wood for both above and below the waterline of the boat.

Epic Resins Epic S7068 is a two component, high strength, structural epoxy resin adhesive designed for bonding fiberglass reinforced plastics and metals. This epoxy adhesive bonds well to most SMC formulations with little or no surface preparation. In addition, S7068 offers mix ratio flexibility and good peel strength.

Vosschemie Benelux YC Super Epoxy 30 GR is a two-component, multi-use epoxy resin adhesive with good chemical and temperature resistance. After a short curing time it already has a high adhesive power for bonding different materials.

Vosschemie Benelux SL Epoxy Primer Anti-Corrosion A+B is a high-quality 2-component solvent-free epoxy primer on an amine basis. The cured layer has a very high resistance capacity and is a good barrier against water. The cured layer does not allow water (vapor) to pass through.

Epic Resins Epic S7422 is a two component epoxy compound designed with a short pot life and anti-sag properties. Epic Resins S7422 is recommended in applications where quick turn over of parts is desired as well as good chemical resistance is needed.

Vosschemie Benelux SL Epoxy Light Primer White A+B is a high quality 2-component epoxy primer which is an excellent preparation coat for paints and topcoats.

BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.

Razeen® LR 2810 is a low viscosity epoxy resin based on bisphenol A/F and modified with an aliphatic diglycidyl ether.

Razeen® SL 2711W57 is a general purpose unmodified epoxy resin based on Bisphenol A with medium viscosity.

Oxy-Bond™ 119-EX Two-Component Epoxy Adhesive has medium viscosity, flexible polyamide adhesive.

Omnilane OC 1005 cycloaliphatic epoxide is miscible with a wide range of organic solvents, including acetone, ethanol, and benzene. It’s low viscosity and good fluidity make it suitable for use in bulk manufacturing. The long term stability at ambient temperature is very good. It will react in the presence of acid anhydride curing agents at higher temperature. Omnilane OC 1005 when cured is suitable for use at high temperatures between 200 - 250°C for long periods.