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NAMICS-Diemat H 9807

NAMICS-Diemat H 9807 is a flip chip adhesive. It has low stress and high reliability and is used in SBB.

Product Type: Conductive Adhesive

Application Area: Circuit Substrates, Electrode, Integrated Circuits, Mounting Applications

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Ready-to-Use Product Features
    Key Features

    This thermoplastic conductive adhesive is used to supplement electrical connections between metallic bumps and mounting substrate electrodes in mounting technology involving direct electrical connections between the circuit on an IC chip, which has conductive bumps, and a mounting substrate.

    Applications & Uses

    Application Method

    Transferring

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Viscosity20.0Pa・s-
    Volume Resistivity0.7 x 10⁻⁴Ω・cm-
    Adhesive Strength0.4N/mm²-
    Cured Properties
    ValueUnitsTest Method / Conditions
    Curing Conditions (120°C)120.0minutes-