Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Key Features
This thermoplastic conductive adhesive is used to supplement electrical connections between metallic bumps and mounting substrate electrodes in mounting technology involving direct electrical connections between the circuit on an IC chip, which has conductive bumps, and a mounting substrate.
Applications & Uses
- Applications
- Application Method
Transferring
Properties
- Typical Properties
- Cured Properties
Value | Units | Test Method / Conditions | |
Viscosity | 20.0 | Pa・s | - |
Volume Resistivity | 0.7 x 10⁻⁴ | Ω・cm | - |
Adhesive Strength | 0.4 | N/mm² | - |
Value | Units | Test Method / Conditions | |
Curing Conditions (120°C) | 120.0 | minutes | - |