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Creative Materials 116-04C

116-04C is a nitride filled, one component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 116-04C is a precatalyzed version of 116-04A/B. 116-04C is a more thermally conductive version of F940A/B.

Features

  • Highly thermally conductive epoxy adhesive/potting compound

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Potting Compound

Application Method: Injection

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Applications & Uses

    Application Method
    Application Method
    • Syringe dispense

    Properties

    Appearance
    Black
    Typical Properties
    ValueUnitsTest Method / Conditions
    Conductivity2.63W/mK-
    Pot Life2 - 4 days--
    Pot Life4 days--
    Typical Cured Properties
    ValueUnitsTest Method / Conditions
    Viscosity3100cps-
    Specific Gravity1.68--
    Hardnessmin. 85Shore D-
    Tensile Strength9600psi-
    Coefficient of Thermal Expansion22ppm/°C-
    Cure Shrinkage0.189%-
    Heat Distortion Temperature115°C-
    Thermal Conduction2.63W/m-K-
    Dielectric Strength475volts/mil-
    Volume Resistivity1x 10^15Ω - cm-
    Power Factor (60 Hz)0.028--
    Dielectric Constant (60 Hz)4.3--
    Water Absorptionmax. 0.22%-
    Useful Temperature Range-55 to 232ºC-
    Thermal StabilityGood to 280°C-

    Regulatory & Compliance

    Certifications & Compliance

    Storage & Handling

    Shelf Life
    3 months at -10°C, 4 days at 25°C, 6 months at -40°C
    Suggested Handling & Curing

    116-04C should be stored frozen until ready to use. Allow material to reach room temperature prior to use. 116-04C is supplied ready to use.

    Handling Properties 30 min. @ 80°C
    Full Cure 2 hr. @ 80°
      1 hr. @ 100°C