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Farboset® 1115

1 of 35 products in this brand
Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Polymer Name: Epoxy Resins & Compounds

Processing Methods: Injection Molding, Transfer Molding

End Uses: Bushings, Coils, Encapsulant, Power Transformers, Switches

Volume Resistivity: 50000000000000.0 - 50000000000000.0 Ohm-m

Flexural Strength: 123.97 - 123.97 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

It is designed for the encapsulation of coils, transformers, bushings, switches and other electrical and electronic components requiring good hot rigidity in molding. This material is used extensively in injection and transfer molding.

Properties

Flame Rating
Physical Form
Flame Rating
UL 94 V0
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength18000psi-
Flexural Strength1265kg/cm²-
Flexural Modulus2.5 x 10⁶psi-
Compressive Strength40000psi-
Compressive Strength2450kg/cm²-
Tensile Strength12500psi-
Tensile Strength850kg/cm²-
Hardness (Shore D)97--
Impact Strength (Izod Notched)0.022kg-m/cm-
Impact Strength (Izod Notched)0.4ft-Ib/inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)130°C-
Glass Transition Temperature (Tg)266°F-
Linear Thermal Expansion (Alpha 1)32x 10⁻⁶cm/cm/°C-
Linear Thermal Expansion (Alpha 2)87x 10⁻⁶cm/cm/°C-
Heat Distortion Temperature (at 18.6 kg/cm²)110°C-
Heat Distortion Temperature (at 264 psi)230°F-
Maximum Intermittent Operating Temperature200°C-
Maximum Intermittent Operating Temperature392°F-
Hot Plate Cure Time (at 150 °C)39seconds-
Thermal Conductivity32x10⁻⁴cal/cm-sec-°C-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance210seconds-
Surface Resistivity1.0 x 10¹⁶ohm-cm-
Dissipation Factor (1 KHz)0.005-ASTM 150
Dielectric Constant (1 KHz)3.8--
Dielectric Strength (Short Time, 125 mils)400volts/mil-
Loss Factor (1 KHz)0.019-ASTM 150
Volume Resistivity5.0x 10¹⁵Ohm - cm-
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 23 °C, 24 hours)0.026%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density1gm/cc-
Molding Pressure3.5 - 70kg/cm²-
Molding Pressure50 - 1,000psi-
Molding Temperature150 - 180°C-
Molding Temperature302 - 356°F-
Mold Shrinkage0.005cm/cm-
Cure Time (at 150°C)1 - 3minutes-
Molded Density2.04gm/cc-
Spiral Flow71cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
2 days - 6 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 6
Storage Life (Not more than 40% loss of spiral flow based on original values.) 25 °C , weeks 1
Storage Life (Not more than 40% loss of spiral flow based on original values.) 35 °C, days 2