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Cosmic Epoxy E4930R

1 of 25 products in this brand
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Encapsulant, Optocoupler, Resistor, Transistor

Volume Resistivity: 10000000000000.0 - 10000000000000.0 Ohm-m

Flexural Strength: 103.35 - 103.35 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features
  • It has excellent moisture resistance and thermal cycling stability.
  • Standard spiral flow range is 30-40” (EMMI) at 160 0C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi.
  • It has a hot plate gel time of 35-45 seconds at 160 0C.

Applications & Uses

Product Applications

Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS’s and QFP.

Properties

Flame Rating
Physical Form
Flame Rating
UL 94 V0
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength15000psi-
Flexural Modulus2.0 x 10⁶psi-
Compressive Strength28000psi-
Tensile Strength12000psi-
Impact Strength (Izod Notched)0.6ft-lb / inch-
Barcol Hardness65--
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature260°C-
Glass Transition Temperature (Tg)165°C-
Coefficient of Linear Expansion (Alpha 1)25 x 10⁻⁶°C-
Coefficient of Linear Expansion (Alpha 2)80 x 10⁻⁶°C-
Thermal Conductivity30 x 10⁻⁴cal/sec/cm²/°C/cm-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds-
Volume Resistance1 x 10¹⁵Ohm - cm-
Surface Resistance1 x 10¹⁵Ohm - cm-
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil-
Dielectric Breakdown (Step-by-Step, Wet)56Kv-
Dielectric Constant (at 1 KHz, Wet)4.2--
Dissipation Factor (at 1KHz, Wet)0.012--
Dielectric Constant (at 1 MHz, Wet)4.5--
Dissipation Factor (at 1MHz, Wet)0.011--
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.85--
Bulk Factor2 - 5--
Molding Pressure500 - 8,000psi-
Molding Temperature150 - 180°C-
Mold Shrinkage0.002 - 0.004In / In-

Regulatory & Compliance

Certifications & Compliance