Products in Ready-to-Use Products: Epoxy Adhesive

ARCOR® EE-96 is a solvent-free, two-component rebuilding compound specifically formulated to provide high wear and abrasion resistance. It serves as an ideal rebuilding and repair material for metals that have been damaged by corrosion, erosion, abrasion, or cavitation. With its exceptional durability, ARCOR® EE-96 is particularly well-suited for high-wear flooring applications in aggressive wear and impact zones, offering a reliable non-skid surface. This non-sagging compound maintains its integrity up to 200 mils without shrinking during the curing process. It exhibits excellent adhesion to both metal and concrete surfaces, ensuring a robust bond. As a Novolac Epoxy, ARCOR® EE-96 demonstrates excellent resistance in a wide range of chemical environments and can withstand heat up to 450ºF. Choose ARCOR® EE-96 for a dependable rebuilding compound that provides exceptional wear resistance, protects against corrosion and erosion, and maintains structural integrity in demanding environments. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-99KC is an Epoxy Rebuild compound designed for rapid set and cure, making it comparable to our EE-94 in resin design. It features a similar loading and mesh size of Ceramic Beads, ensuring high performance. With its self-wetting formulation, this compound can be applied without a primer and is suitable for vertical and overhead applications up to +3/4″ (750 mils, 18.75mm) thickness. It can be easily leveled to a smooth finish, eliminating the need for a topcoat and significantly reducing application and turnaround time. ARCOR® EE-99KC offers a convenient 2:1 mix ratio by weight and volume, making it ideal for easy breakdown in-field. Its rapid curing properties allow for a return to service in as little as 1 hour, ensuring minimal downtime. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-951 is a solvent-free epoxy with a high 3.6 functionality Novolac composition, specifically designed as a top-tier rebuilding material for metals in highly aggressive chemical and temperature immersion service. With its exceptional properties, ARCOR® EE-951 is ideally suited for restoring or cladding applications, providing unmatched corrosion and abrasion protection. The versatility of ARCOR® EE-951 allows for easy application up to an impressive 500 mils, without any concerns of slump. Experience the reliability and effectiveness of ARCOR® EE-951, delivering unparalleled durability and safeguarding against the harshest conditions for your metal surfaces. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-97 is a solvent-free, two-component rebuilding compound specifically designed to repair damaged, cracked, or worn metal surfaces. This non-sagging compound exhibits excellent adhesion to all metal surfaces and can be machined using carbide or high-speed cutting tools. With its impressive wear, abrasion, and impact resistance, ARCOR® EE-97 is a reliable choice for addressing various surface imperfections. As a Novolac Epoxy, it offers superior resistance in a wide range of chemical environments and can withstand temperatures up to 450ºF. Whether it's drilling, tapping, or sanding, this versatile compound provides a durable and machinable solution for restoring metal surfaces to their original strength and functionality. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-93 is a solvent-free, two-component rebuilding compound specifically designed to withstand high levels of abrasion, erosion, and cavitation. This remarkable product is a Novolac Epoxy filled with spherical cubic zirconium, providing it with the utmost chemical, heat, and abrasion resistance achievable in an epoxy system. Its self-wetting formulation allows for application without the need for a primer, and it can be smoothly leveled to achieve a seamless finish, eliminating the requirement for a top coat. ARCOR® EE-93 significantly reduces application and turnaround time while delivering exceptional performance. It is the ideal choice for environments that demand superior durability and efficiency. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-94 HW is an enhanced wear/impact version of EE-94, offering improved chemical and temperature performance. This high-quality epoxy, filled with high density ceramic beads, delivers the utmost level of chemical, heat, and abrasion resistance available in an epoxy system. With its self-wetting formulation, it can be applied directly without the need for a primer. Additionally, it can be applied at a thickness of up to +1" (1000 mils, 25mm) on vertical and overhead surfaces. The compound can be leveled smoothly, eliminating the need for a topcoat and significantly reducing application and turn-around time. ARCOR® EE-94 HW is the ideal choice for applications requiring exceptional durability and quick installation. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® 2213 Stick is a convenient, solvent-free, two-component epoxy paste packaged in an easy-to-use stick form, combining both the Activator and Base components. With a simple cut or twist, a desired amount can be easily extracted and kneaded using gloved fingers. This rapid-curing epoxy is particularly well-suited for emergency repairs, allowing for quick fixes when time is of the essence. ARCOR® 2213 exhibits corrosion resistance and is reinforced with steel for excellent wear resistance. It can be further modified to meet specific requirements as it can be sanded, drilled, tapped, filed, and machined. Furthermore, it is compatible with epoxy, urethane, or acrylic paints, offering versatility in the choice of final finishes. Choose ARCOR® 2213 Stick for its convenience, durability, and efficiency in handling emergency repairs with excellent wear resistance and a wide range of applicability. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-951 HT is a solvent-free, high 3.6 functionality epoxy Novolac that serves as an exceptional rebuilding material for metals in highly aggressive chemical and temperature immersion service. Designed with precision, ARCOR® EE-951 HT is an ideal choice for restoration or cladding purposes, providing superior corrosion and abrasion protection. With its remarkable application flexibility, ARCOR® EE-951 HT can be applied up to an impressive 500 mils without any concerns of slump. Experience the reliability and performance of ARCOR® EE-951 HT, delivering outstanding protection and durability for your metal surfaces in the most demanding and challenging environments. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-95 is a solvent-free epoxy Novolac, specially formulated as an exceptional rebuilding material for metals in immersion service. It is the ideal choice for restoring or cladding applications, offering reliable corrosion and abrasion protection for condensers, heat exchangers, and FGD units. With its high-performance features, ARCOR® EE-95 can be applied up to an impressive thickness of 500 mils without experiencing any slump. Count on the superior durability and effectiveness of ARCOR® EE-95 to ensure the long-lasting integrity of your equipment in challenging environments. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-99 is a solvent-free, two-component epoxy rebuild that is moisture insensitive. It serves as an exceptional emergency repair or bonding material for metals, glass, concrete, or wood. With a quick setting time of just 5 minutes, ARCOR® EE-99 can be put into service within 1 hour, regardless of temperature. This versatile epoxy exhibits good resistance to a wide range of chemical environments and can withstand heat up to 450ºF. The convenient 1:1 mix ratio makes it easy to use, and it can be applied overhead or vertically. ARCOR® EE-99 is a reliable and efficient solution for various repair and bonding applications. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-94 is a solvent-free, two-component rebuilding compound specifically designed for harsh environments with high abrasion, erosion, and impact. This remarkable compound is a Novolac Epoxy filled with ceramic beads, providing the utmost level of chemical, heat, and abrasion resistance achievable in an epoxy system. With its self-wetting formulation, it can be applied directly without the need for a primer. It is also capable of being applied at a thickness of 1" (1000 mils) on both vertical and overhead surfaces. Furthermore, ARCOR® EE-94 can be easily leveled to achieve a smooth finish, eliminating the requirement for a topcoat. By doing so, it significantly minimizes application time and turnaround. ARCOR® EE-94 is the ideal choice for applications demanding superior durability and efficiency. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® 25551 Quick-Set is a solvent-free, two-component epoxy adhesive that is moisture insensitive. Designed for emergency repairs or bonding applications, it is suitable for use on metals, glass, concrete, or wood surfaces. With its quick-setting formula, ARCOR® 25551 Quick-Set sets in just 5 minutes and can be put into service within 1 hour, regardless of the ambient temperature. This adhesive exhibits good resistance to a wide variety of chemical environments and offers heat resistance up to 450ºF. Its easy-to-use 1:1 mix ratio simplifies the application process, and it can be applied overhead or vertically. For convenient use, ARCOR® 25551 Quick-Set is packaged in two tubes containing resin and hardener. To achieve optimal results, simply squeeze equal portions onto a nonporous surface and thoroughly mix them together. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

ARCOR® EE-92 is an Epoxy Rebuild compound that closely resembles our EE-94 variant in terms of resin and amine composition, with the distinction of incorporating smaller mesh Ceramic Beads. By combining these high crush strength ceramic beads with the addition of robust Kevlar fibers, EE-92 exhibits an exceptional level of impact, abrasion, and compressive strengths. This self-wetting formulation allows for application without the need for a primer and can be efficiently applied at a thickness of up to +1/2" (500 mils, 12.5mm) on both vertical and overhead surfaces. Moreover, it can be easily leveled to achieve a smooth finish, eliminating the requirement for a topcoat and significantly reducing application time and turnaround. ARCOR® EE-92 offers a highly convenient 1:1 Mix Ratio, whether by weight or volume, making it well-suited for efficient breakdown in the field. Similar to our 8506 variant, EE-92 delivers comparable application properties, appearance, and texture. ARCOR Epoxy Technologies can tailor make or reformulate the product to suit customer needs. Please reach out if you need a custom formulated product!

FLASHBOND™ UV-6502CL is a low viscosity, high clarity, light curing epoxy adhesive that offers excellent strength wetting properties. UV-6502CL cures to a clear polymer and maintains clarity at elevated temperatures. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm).

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength Increased flexibility

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive