Products in Off Road & Commercial Vehicle Coatings: Curing Agent

DYTEK® BHMT HP (bis-hexamethylene triamine) is a high purity (>95%) triamine that is used in applications where purity is critical such as phosphonate scavenger and flocculant in oil & gas applications and as a hardener in epoxy coating and adhesive applications.

DYTEK® BHMT (bis-hexamethylene triamine) is a long chain triamine that is used as a binder in asphalt, as a phosphonate scavenger and flocculant in oil & gas applications, and as a hardener in epoxy coating and adhesive applications.

EPOTUF® 37-640 is a polyamide curing agent based on dimerized fatty acids and polyethylene amines for room temperature curing of EPOTUF® epoxy resins.

Technicure® IPDU-8, N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability. Among all substituted ureas as DICY cure accelerators, IPDU-8 offers the most latency.

Lu'An Jietonda New Material K7318 is a Low temperature curing accelerator for powder coatings.Jietonda® K7318 is a new anti-yellowing low temperature curing accelerator,designed for powder coatings based on PES/TGIC and hybrid, to reduce curing temperature or shorten curing time.

EPOTUF® 37-618 is a solution of 37-615, a polyamide curing agent based on dimerized fatty acids and polyethylene amines for room temperature curing of EPOTUF® solid epoxy resins.

Technicure® D-44 is a pulverized grade of dicyandiamide with an average particle size of about 20 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Due to larger particle size, the products offers lower exothermic heat than the finer grade of Dicy. Technicure® D-44 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Lu'An Jietonda New Material SA316 is a Curing accelerator for powder coatings.Jietonda® SA316 is a special quaternary ammonium compound that can be used as curing accelerator for powder coatings based on Epoxy, Epoxy/Polyester hybrid and Polyester/TGIC to improve curing performance. It may also be used as internal catalyst for carboxyl terminated polyester resin to provide lower cure temperature or shorter baking time.

Resicure® D-5 is a pulverized grade of dicyamdiamide with an average particle size of about 5 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-5 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Technicure® D-10 is a pulverized grade of dicyandiamide with an average particle size of about 10 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-10 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted urea such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Technicure® D-10 is available without fumed silica or with a different flow control agent.

Technicure® TDU-200M is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® PDU-250M, N,N-dimethyl-N-phenyl urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Lu'An Jietonda New Material K7312 low temperature curing accelerator for powder coatings.Jietonda® K7312 is a curing accelerator specially used for polyester/GMA system, which can significantly improve the degree of crosslinking of the system, thereby improving the solvent resistance and impact resistance of the coating film.

Technicure® DCMU is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Resicure® 2MI is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 3-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 1.5 phr. Jet milled grade of Resicure imidazole is available as Resicure 2MI-J.

Technicure® MDU-11M, [4,4’- (methylene bis (phenyl dimethyl)] urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® 101 is an Imidazole Epoxy Adduct Curing Agent.