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Farboset® 1180

1 of 35 products in this brand
Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

Polymer Name: Epoxy Resins & Compounds

End Uses: Encapsulant

Technical Data Sheet
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Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers End Uses
Product Applications

It is designed for the encapsulation applications requiring outstanding thermal shock resistance and physical strength.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength19000.0psi-
Flexural Strength1330.0kg/cm²-
Compressive Strength33000.0psi-
Compressive Strength2.31kg/cm²-
Tensile Strength12000.0psi-
Tensile Strength845.0kg/cm²-
Hardness (Shore D)70.0--
Impact Strength (Izod Notched)0.028kg-m/cm-
Impact Strength (Izod Notched)0.5ft-Ib/inch-
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg)125.0°C-
Linear Thermal Expansion (Alpha 1)35x 10⁻⁶cm/cm/°C-
Linear Thermal Expansion (Alpha 2)110 x 10⁻⁶cm/cm/°C-
Heat Distortion Temperature (at 18.6 kg/cm²)110.0°C-
Heat Distortion Temperature (at 264 psi)230.0°F-
Maximum Intermittent Operating Temperature200.0°C-
Hot Plate Cure Time (at 150 °C)40.0seconds-
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180.0seconds-
Dissipation Factor (1 KHz)0.004-ASTM 150
Dielectric Constant (1 KHz)3.9--
Dielectric Strength (Short Time, 125 mils)350.0volts/mil-
Loss Factor (1 KHz)0.016-ASTM 150
Volume Resistivity1.0 x 10¹⁵Ohm - cm-
Surface Resistivity1x 10¹⁶ohm-cm-
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Bulk Density0.95gm/cc-
Molding Pressure3.5 - 70kg/cm²-
Molding Pressure50 - 1,000psi-
Molding Temperature150 - 180°C-
Molding Temperature302 - 356°F-
Mold Shrinkage0.006cm/cm-
Cure Time (at 150°C)1 - 3minutes-
Spiral Flow89.0cmEMMI 1-66A

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
2 days - 12 months
Storage and Shelf life Conditions
Storage Specification Data
Recommended Storage Temperature °C 4
Storage Life (Not more than 40% loss of spiral flow based on original values.) 5 °C , months 12
Storage Life (Not more than 40% loss of spiral flow based on original values.) 25 °C , weeks 1
Storage Life (Not more than 40% loss of spiral flow based on original values.) 35 °C, days 2