Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Application Area
- Application Method
- Product Applications
This compound is designed for coating resistor networks, hybrid circuits, varistors and ceramic capacitors. It is suitable for use on wheel and fluid bed equipment.
Properties
- Thermal Properties
- Electrical Properties
- Powder Characteristics
- Moisture Properties
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (Tg) | 105.0 | °C | - |
| Linear Thermal Expansion (Alpha 1) | 60x 10⁻⁶ | cm/cm/°C | - |
| Linear Thermal Expansion (Alpha 2) | 160x 10⁻⁶ | cm/cm/°C | - |
| Thermal Conductivity | 7 x 10⁻⁴ | cal/cm-sec-°C | - |
| Sag Resistance (at 155°C, 40°angle) | 120.0 | mm | - |
| Hot Plate Gel Time (at 150 °C) | 105.0 | seconds | - |
| Value | Units | Test Method / Conditions | |
| Dissipation Factor (1 KHz) | 0.01 | - | ASTM 150 |
| Dielectric Constant (1 KHz) | 3.8 | - | ASTM 150 |
| Dielectric Strength | 850.0 | volts/mil | ASTM 149 |
| Surface Resistivity | 1x 10¹⁶ | ohm-cm | - |
| Volume Resistivity | 8.0x 10¹⁵ | Ohm - cm | - |
| Value | Units | Test Method / Conditions | |
| Particle Size (U.S. Mesh, +80 max) | 1.0 | % | - |
| Particle Size (U.S. Mesh, -325) | 30 - 40 | % | - |
| Cure Time (at 125°C) | 60.0 | minutes | - |
| Cure Time (at 150°C) | 18.0 | minutes | - |
| Cure Time (at 175°C) | 10.0 | minutes | - |
| Molded Density | 1.44 | gm/cc | - |
| Value | Units | Test Method / Conditions | |
| Water Absorption (at 23 °C, 24 hours) | 0.07 | % | - |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 4 - 6 months
- Storage and Shelf life Conditions
Storage Specification Data Recommended Storage Temperature °C 18 Storage Life (Not more than 40% loss of spiral flow based on original values.) 4 °C , months 6 Storage Life (Not more than 40% loss of spiral flow based on original values.) 21 °C, months 4