Products in Packaging & Assembly: Thermally Conductive

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

CHT Group QSil 550LV A&C is a 100% silicone solids elastomer designed for electronic potting applications. This addition-cure potting elastomer is a two-component system that offers a hard, thermally conductive, low-modulus material that is readily repairable. It cures at room temperature.

CHT Group SE3000 is a 2-component silicone elastomer system specially designed for electronic potting and encapsulation applications. It offers good protection against chemicals, environmental contamination, mechanical shock, vibration, and impact damage. It can be employed in areas where low flammability is a prerequisite. The cured elastomer can be repaired. The component parts have relatively low viscosities and are readily mixed, either by hand or machine.

CHT Group QSil 559 is a 100% silicone solid elastomer designed for electrical potting applications. This addition-cure potting material is a two-component system that has a long gel time. It offers a hard, thermally conductive, low-modulus material that is readily repairable.

CHT Group QSil 573 is a 100% silicone solid elastomer designed for electronic potting applications. This addition-cure potting elastomer is a two-component system that offers a hard, thermally conductive, low-modulus material that is readily repairable. This product has excellent thermal conductivity.

CHT Group AS1707 is a non-corrosive, neutral-cure, 1-part, RTV (Room Temperature Vulcanizing) silicone adhesive sealant. It is one in a range of alkoxy cure products that are solvent-free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature to form a tough rubber when in contact with atmospheric moisture. This product will not corrode copper or its alloys and is suitable for use with electronic components.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound

102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.FeaturesTwo component, low CTE, low flow epoxy adhesive.

SilCool TIA241GF – Liquid Silicone Thermal Pad TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If lower viscosity is required, use TIA225GF

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

TIA225GF - Silicone Thermal Gap Filler TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If higher thermal conductivity is desired, use SilCool TIA241GF.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics

TP8205 is a silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

ME7155 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits not only outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper), but also exhibits high level of uniformity and consistency in appearance and smoothness of texture, yielding potential ease of use and success in applications. The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. MEZ155 can be readily reworked at 80-1502.