Products in Electrical & Electronics: Epoxy & Epoxy Derivatives

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive

Applied Technologies 5921 Silver Epoxy is a highly flexible, two component, silver filled epoxy designed for easy noncritical 1:1 mixing and cure responses at either room temperature (20-25°C) or low heat (100°C). Applications include making and/or repairing flexible circuitry on a variety of plastic substrates including both raw and Indium Tin Oxide coated polyester films. Other uses include chip bonding, die attachment, and solderless wire connections. This material when properly cured, is highly conductive, exhibits outstanding adhesion, and is extremely crack resistant - even when creased at 180°C.

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

CM14 resin is Mid Tg fast cure press curable prepreg system which is also dicy free formulated against waterspot/whitespot problems. CM14 resin system is especially formulated for cosmetic grade visual carbon look. Drapability is suitable for press molds and low to medium tack optimized for press curing.

Super SAP® CCR/CCS is a clear, UV-stabilized epoxy system designed specifically for casting, potting, and embedding applications. Low color and low viscosity allow for bubble-free, crystal-clear castings ideal for art and hobby applications. This Super Sap® Formulation features two hardener speeds: slow (CCS) for high-build casting epoxy applications and fast (CCF) for quick, small project fast casting epoxy applications such as resin jewelry and more.

APCM DA 4518 E-Glass is a modified epoxy system coated on heavy weight unidirectional E-Glass fibers. This product is designed to build excellent unidirectional strength using a minimum number of plies. DA 4518/E-Glass Uni also features extended room temperature out time and service temperatures to 300°F.

MICAM’s CG-11 is a high heat resistance epoxy-glass copper clad laminate with excellent mechanical and electrical performance

AX-3112T is a High Toughness, Flame Retardant, Epoxy Fiberglass Prepreg.

VisiJet® SL HiTemp High temperature resistance to 130°C+ (266°F+) Translucent Humidity and chemically resistant with high rigidity Long term stable properties Ideal for under-the-hood component testing

Accura® CeraMAX is a a rigid ceramic-reinforced composite with excellent thermal, moisture and abrasion resistance.applications heat and wear resistant components stiff/rigid assemblies and prototypes composite ceramic-like components esthetic components for art and archival models moisture stable components automotive and aerospace applications a plastic-ceramic composite high thermal resistance excellent abrasion resistance moisture resistant extremely rigid benefits esthetically beautiful white parts withstand temperatures of up to 220°C models that can withstand wear in aggressive applications components can survive in adverse thermal environments components can be plated parts retain properties & dimensions for extended durations.

Tough-Seal 24 A a tough and durable two component, hybrid epoxy elastomer that features a higher viscosity than KEY Tough-Seal 22 to limit lateral flow in “glob top” encapsulation. KEY PC2024A/Bis a superior electrical potting compound with excellent thermal cycling performance.

Vetronite® FR-5 HF CTI 600M is composed of epoxy matrix and glass fabric reinforcement. it appears in Red color with EP GC 204/311 FR-5 Standards.

Cast-Coat Inc. CC3-465 was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity. CC3-465 is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.

Applied Technologies 5978-14 Silver Epoxy is a high solids, one-component, silver filled epoxy designed for screen printing. Applications include printed circuit board repairs, electrical solder replacement, chip bonding, die attachment, static discharge/grounding, windshield bus bars and use as a general conductive cement for heat sensitive components. This material exhibits outstanding adhesion to a variety of substrates including ceramic, glass, metal, and plastic.

Araldite® GY 6010 is a general purpose unmodified epoxy resin based on Bisphenol A with medium viscosity.

Atom Adhesives Metal-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Metal-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

SynFoam ELG is a two part closed cell syntactic resin system that is based on epoxy rather than polyurethane chemistry. ELG can withstand continuous exposure up to 300oF and retain it's rigidity. SynFoam ELG has low dielectric loss and dielectric properties. The weight is significantly lower than most low loss materials used for electronic applications. The system is suitable for both electronic potting and encapsulation as well as structural support. SynFoam ELG is shipped as two components which when mixed together can be poured and cast into various shapes and sizes. SynFoam ELG is available in 1 and 5 gallon kit sizes. Each kit contains an A and B side that must be mixed together prior to casting. SynFoam ELG does not require temperature to cure, but requires higher postcure temperatures to reach the maximum service use temperature. Please consult the appropriate instructions prior to using ELG.

Fielco Adhesives Odyssey 6860 is a rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies.

Tough-Seal 22 A is a tough and durable two component, hybrid epoxy elastomer that features a longer gel time than Tough-Seal 21. Tough-Seal is a superior electrical potting compound with excellent thermal cycling performance.

ThreeBond Europe SAS TB3380B has been developed for bonding electrical and electronic parts, which require low outgas. A 2-component epoxy type electroconductive adhesive, it may be cured at room temperature, although curing at an elevated temperature reduces the amount of outgas further.

Lindoxy 290 is a non-crystallizing, low viscosity epoxidized phenol novolac resin with an average functionality of 3. Lindoxy 290 is designed for composites that require a high glass transition temperature along with great chemical resistance.

AX-5110 is a flame retardant laminates, honeycomb and foam panels.

United Adhesives SE 1262 is a flexible epoxy coating & encapsulant.

Nuceq C9-4183/HD-3404 system is a 100% solids, two-component epoxy-amine compound.

BONDiT™ B-536 is a two-part, very high strength, 100% solids, room-temperature curing semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding to a wide range of engineering plastics, including polyolefin and metals, glass, ceramic, composite and wood. Typical example of lapshear bond strength is 1100 PSI for PEEK-to-PEEK and PEEK-to-Steel substrates. B-536 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, and detergents. B-536 has high thermal stability and offers good corrosion resistance. The semi- flexible properties of B-536 permits assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-536 and protect surfaces and bonded assemblies.

XRD1018 is a two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets ul94-v0 in house flammability testing.

IBA Kimya San. ve Tic. A.S. FF87 is a thermosetting powder coatings based on epoxy and polyester resins designed for interior applications. It has excellent flow out and good yellowing resistance.

Addison Clear Wave Coatings AC A1430-B is a UV curable adhesive fo rigid OLED applications, obtained by cataionic polymerization. It is a one component adhesive ready for use, solvent free and it is stable at room temperature.

Lattice Composites LCMC-G1 is used as general-purpose BMC. It is net shape, easy processing, high stiffness.

Atom Adhesives Wood-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Wood-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Anchor Seal SY6009T* Black is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is used in low health hazard, thermal conducting switches.

Triune Chemicals and Materials LE-828LV is less crystallize resin which can be widely used in all applications like Coatings, Adhesive, Casting, Composite, Civil Engineering and Electric and electronics fields..

Humiseal Epoxy Adhesives Family perform in the most challenging environments due to their robust curing mechanism and resulting strength. Epoxies are used in industries including electronics, automotive, and health care devices among others. Humiseal epoxy adhesives are supplied as 2 components, chemical cure systems.

Razeen® LR 2282 is a general purpose unmodified epoxy resin based on Bisphenol F with medium viscosity.

Lectromat Glass Cloth and Mats DG-610 is applied in shrinkable coil armor tape.

Addison Clear Wave Coatings AC A1450-TX is a UV curable epoxy adhesive obtained by cataionic polymerization. It is a one component adhesive ready for use, solvent free and it is stable at room temperature.