Products in Devices & Assemblies: Epoxy & Epoxy Derivatives

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

MC511SN, StatNot™, is a static dissipative epoxy, woven glass based material with excellent control of the static dissipative properties. This material is used where static dissipation is required from surfaces to surface of the composite, in the x, y and z directions.

NP572 is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC and its Tg is guaranteed to be 180°C or greater. Typical applications include electrical equipment subjected to elevated temperatures. NP572 is certifiable to IEC 60216-3, IEEE STD 98-2002 and ASTM D2304 for Class H insulation in electrical devices. NP572 is also certifiable to MIL-I-24768/3, Type GEB.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

Valtron® AD1846A-AD1851B Epoxy System is a temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and LED wafer slicing process. It has good water resistance. Applicable for diamond wire saw with selected debonding solutions.

Valtron® AD5038A-AD5038B Epoxy System is a low viscosity, temporary adhesive system ideal for slicing applications where polyethylene glycol (PEG), PEG/water and water coolant is used as a slicing vehicle or a coolant. It has good water resistance.

Valtron® AD1238A-AD3848BR Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for the wafer slicing, fast-curing and high bond strength. Applicable for automatic dispensing systems.

ADEKA™ EP-7001, an epoxy resin and compound polymer, is a cutting-edge solution in the realm of plastics technology. Tailored for casting methods, it exhibits remarkable features like good adhesion and flexibility. Positioned for excellence, ADEKA™ EP-7001 finds its applications in the automotive and transportation and electrical and electronics markets, meeting the demands of electrical and electronic applications and engineering applications with precision.

ADEKA™ EP-4300E, a premier epoxy resin and compound polymer, stands out for its technological prowess in plastics. Engineered with materials featuring low viscosity, it caters to the intricate demands of electrical and electronic applications. Its excellence extends to processing methods, particularly casting, making it the top choice for industries seeking superior performance and reliability.

ADEKA™ EP-4100G, a variant of epoxy resins and compounds, stands out with its general-purpose material features. Specifically designed for plastics and elastomers processed using casting methods, this polymer finds versatile applications. Its end uses span across electrical and electronic applications and general-purpose industrial scenarios, making ADEKA™ EP-4100G a reliable choice for various manufacturing needs.

ADEKA™ EP-4000, identified by the polymer name epoxy resins and compounds, finds application in engineered and electrical/electronic applications. Noted for its material features of good adhesion and flexibility, this product is specifically tailored for processing methods such as casting in plastics and elastomers. ADEKA™ EP-4000 stands as a reliable choice in industries where superior adhesion, flexibility, and versatile processing methods are essential.

ADEKA™ EP-4400, a distinguished epoxy resin and compound polymer, excels at catering to the specialized needs of electrical, electronic, and engineered applications. Engineered for casting, its material features, including its amorphous nature and good adhesion, make it an optimal choice for industries requiring reliability and top-notch performance.

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

Loxon, the “work horse” of the appliance industry, is a blend of high-tech polymers specifically synthesized and produced for metal decorating applications. Loxon has been developed to meet new appliance specifications. It has superior resistance to laundry group detergents and new generation spot removers. Loxon has passed virtually all other chemical resistance tests called for in the appliance industry.

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

Deco-Chem’s Baking Size Coats are a one-part clear epoxy-based solution. They have been developed to meet new appliance specifications and have superior resistance to laundry group detergents and new generation spot removers. Baking Size Coats have passed virtually all other chemical resistance tests in the appliance industry.

Epoxon is a two component epoxy screen ink formulated specifically for general purpose use on a variety of surfaces. EPO has passed the rigid requirements of the automotive group such as chemical resistance, hardness, flexibility, abrasion resistance and consistency of color.

Loxon, the “work horse” of the appliance industry, is a blend of high-tech polymers specifically synthesized and produced for metal decorating applications. Loxon has been developed to meet new appliance specifications. It has superior resistance to laundry group detergents and new generation spot removers. Loxon has passed virtually all other chemical resistance tests called for in the appliance industry.

EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

SetWORX™ 411HP is a toughened, high strength, industrial grade structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. 411HP is a one component, heat cure, conductive epoxy adhesive. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications.