Other Building & Construction Applications

TEGO® Antifoam 1488 is a versatile emulsion-based anti-foaming agent tailored for various applications. It effectively controls foam formation in processes like emulsion polymerization and textile sizing. With good compatibility, it finds use in diverse industrial additives, including metalworking fluids and nonwovens. This emulsion-type additive is available in drums, catering to different production scales. Its performance spans markets like adhesives and sealants, fluids and lubricants, and building materials. TEGO® Antifoam 1488's role in polymer dispersions manufacturing adds to its versatility and value.

AEROSIL® R 972 is hydrophobic fumed silica grade treated with DDS (Dichlordimethylsilane). The moderate hydrophobicity of these AEROSIL® products is suited for defoaming properties in the presence of appropriate hydrophobic liquids. They are recomended for improving the sedimentation stability of defoamer dispersions as well.

AEROSIL® 200 is a hydrophilic fumed silica with a specific surface area of 200 m²/g.

TEGO® Antifoam 4-88 is an APEO-free and mineral oil-free emulsion antifoam containing organo-modified siloxanes. This anti-foaming agent is designed for use in waterborne adhesive applications and is particularly compatible with substrates such as paper and wood. It falls within the category of CASE ingredients, specifically within the realm of foam control additives, presenting itself in emulsion form

AEROSIL® R 812 is hydrophobic fumed silica grade treated with HMDS (Hexamethyldisilazane). It can be used for sedimentation stabilization and due to its high hydrophobicity as defoaming agent.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.