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Packaging & Assembly
Products in Packaging & Assembly: Dimensional Stability
26 Products found in Packaging & Assembly
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AGC Chemicals Americas, Inc.
RESIFA™ SOLESPHERE™ NP-200
Chemical Family:
Barium Salts, Silica
Functions:
Carrier, Filler
AGC Chemicals Americas, Inc. RESIFA™ SOLESPHERE™ NP-200 is a non-porous, heat-treated silica particle. Belonging to the NP-series, it has a very high hardness, so it is often used as a filler for increasing resin hardness. The high refractiveness of these grades offers good transparency when added to resins and films. It is also used for anti-blocking in film applications. The NP-series has excellent heat resistance and is very dimensionally stable at various temperature ranges.
AGC Chemicals Americas, Inc.
RESIFA™ SOLESPHERE™ NP-30
Chemical Family:
Barites & Barium Salts, Silica
Functions:
Flame Retardant, Lubricant, Carrier, Filler, Adsorbent
AGC Chemicals Americas, Inc. RESIFA™ SOLESPHERE™ NP-30 is a non-porous, heat-treated silica particle. Belonging to the NP-series, it has a very high hardness, so it is often used as a filler for increasing resin hardness. The high refractiveness of these grades offers good transparency when added to resins and films. It is also used for anti-blocking in film applications. The NP-series has excellent heat resistance and is very dimensionally stable at various temperature ranges.
AGC Chemicals Americas, Inc.
RESIFA™ SOLESPHERE™ NP-100
Chemical Family:
Sulfates, Silica
Functions:
Carrier, Filler, Adsorbent, Flame Retardant
AGC Chemicals Americas, Inc. RESIFA™ SOLESPHERE™ NP-100 is a non-porous, heat-treated silica particle. Belonging to the NP-series, it has a very high hardness, so it is often used as a filler for increasing resin hardness. The high refractiveness of these grades offers good transparency when added to resins and films. It is also used for anti-blocking in film applications. The NP-series has excellent heat resistance and is very dimensionally stable at various temperature ranges.
Cosmic Plastics
Cosmic Epoxy E4940P
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.
Cosmic Plastics
Cosmic Epoxy E4940S
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Takaroku Shoji
Takaroku Shoji TRF-AK-72-4
Polymer Name:
Acrylonitrile Butadiene Styrene (ABS)
Processing Methods:
Injection Molding
Takaroku Shoji TRF-AK-72-4 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Takaroku Shoji
Takaroku Shoji TRF-PP-TY9
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Extrusion
Takaroku Shoji TRF-PP-TY9 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Polyplex
Sarafil TF100 - 12 Microns
Polymer Name:
Polyethylene Terephthalate (PET)
Physical Form:
Film
Features:
Good Thermal Stability, Dimensional Stability, Ease of Handling, High Tensile Strength
Sarafil TF100 - 12 Microns offer wide range of products and solutions for various Packaging and Industrial applications.
Manifattura Cattaneo
Manifattura Cattaneo PET + PTFE
Density:
1460.0 - 1460.0 kg/m³
Tensile Modulus:
3450.0 - 3450.0 MPa
Manifattura Cattaneo PET + PTFEis a polyethylene terephthalate modified in the structure by the incorporation of dispersed PTFE. This specific formulation exhibits extraordinary self-lubricating properties, in addition to having excellent wear resistance, it offers a better coefficient of friction.
ASTAR S.A.
Verkid® BMC PX4
Functions:
Molding Compound
Polymer Name:
Polyester (unspecified)
Reinforcement Material:
Carbon Fibers
Processing Methods:
Compression Molding, Injection Molding
End Uses:
Semiconductor Applications
Verkid® BMC PX4 is a fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives. Generally thermoset unsaturated polyester or vynil-ester resins are used as organic matrix. With the aim of enhance its characteristics and improve its transformation, other components are added: catalysts, inhibitors, thermoplastic additives, demoulding agents, thickeners and pigments.
Nanocyl
PLASTICYL™ POM1001
Functions:
Conductive Agent
Processing Methods:
Injection Molding, Extrusion
Carrier:
Polyoxymethylene (POM), Resin-based
PLASTICYL™ POM1001 is a conductive masterbatch based on Polyoxymethylene (polyacetals) loaded with 10% of Nanocyl’s MWCNTs (NC7000™). Because of its high flow, PLASTICYL™ POM1001 is ideal for injection molding and extrusion processes.
Sinoplast
Sinoplast Glass fiber strengthen 3010-G10
Polymer Name:
Polycarbonate (PC)
Fillers Included:
Glass Fiber
POLYKING® Polycarbonate is a kind of amorphous engineer thermoplastic material and with very high mechanical, optics, electricity and thermal properties. The combination of these physical property makes it become one of the most excellent engineer thermoplastic materials. And it is widely used in electrical and electronics, automotive, package, electricity and electronic industry etc. .
ASTAR S.A.
Carbkid® Fiber VE SMC
Functions:
Molding Compound
Chemical Family:
Epoxy Vinyl Ester
Reinforcement Material:
Carbon Fibers
Processing Methods:
Compression Molding, Injection Molding
End Uses:
Semiconductor Applications
Carbkid® Fiber VE SMC is a polymer composite material reinforced with carbon fiber, which consists of a thermoset resin (usually vinylester or epoxy) and different additives that allow to obtain certain specific characteristics and improve the behavior of the material during the molding process of the final product. While the standard SMC is reinforced with glass fibers, the CSMC is reinforced with cut fibers or carbon fabrics. CSMC materials combine the low-weight characteristics offered by carbon composites in conjunction with a widespread forming process, such as compression molding, which allows for short manufacturing cycles and is therefore suitable for industrial applications in large series.
Takaroku Shoji
Takaroku Shoji TRF-PS02-2
Polymer Name:
Polystyrene (unspecified)
Processing Methods:
Injection Molding
Takaroku Shoji TRF-PS02-2 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Manifattura Cattaneo
Manifattura Cattaneo PET
Polymer Name:
Polyethylene Terephthalate (PET)
Physical Form:
Rods, Sheets
Features:
High Stiffness, Excellent Mechanical Strength, Food Contact Acceptable, Acid Resistant, Radiation Resistant, Wear Resistant, Electrically Insulating, Dimensional Stability, High Hardness, Good Stain Resistance, Creep Resistant, Low Friction
Density:
1390.0 - 1390.0 kg/m³
Tensile Modulus:
3700.0 - 3700.0 MPa
Color:
White, Natural, Black
Manifattura Cattaneo PET is a Crystalline thermoplastic suitable for the production of high precision parts to which good lubrication is added.
Takaroku Shoji
Takaroku Shoji TRF-1026X-14A-18
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Extrusion
Takaroku Shoji TRF-1026X-14A-18 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
HiFi Industrial Film
HiFi Industrial Film SU320
Polymer Name:
Polyester (unspecified)
Physical Form:
Film, Sheets
Features:
Dimensional Stability, High Gloss, High Clarity, Heat Stabilized, Low Shrinkage, Good Printability
HiFi Industrial Film SU320 Is a high clarity, high gloss, heat-stabilized polyester film manufactured by HiFi Industrial Film. It has an adhesion promoting pre-treat on both sides and is suitable for flexible circuits, membrane touch switch, specialized graphics and other applications where it is important to have the minimum level of shrinkage during processing.
ASTAR S.A.
Verkid® SMC H154
Functions:
Molding Compound
Chemical Family:
Polyesters, Unsaturated Polyester (UPE)
Reinforcement Material:
Carbon Fibers
Processing Methods:
Compression Molding, Injection Molding
End Uses:
Semiconductor Applications
Verkid® SMC H154 is used in hot press, compression molding for the production of large parts with high mechanical properties and excellent surface finish. It is a glass fiber reinforced compound, in a thermoset resin matrix, with mineral fillers and different additives.
Smiths Metal Centres
Smiths Metal Centres Polycarbonate (PC GF 20)
Polymer Name:
Polycarbonate (PC)
Physical Form:
Bars, Sheets, Rods
Features:
Excellent Stiffness, Low Thermal Expansion, Recyclable, Heat Resistance, Electrically Insulating, Good Machinability, Dimensional Stability, High Tensile Strength, Good Impact Strength
Density:
1350.0 - 1350.0 kg/m³
Color:
Transparent
Smiths Metal Centers Polycarbonate (PC GF 20) is an enhanced version of PC, with improved stiffness, tensile strength and a lower coefficient thermal expansion.
Takaroku Shoji
Takaroku Shoji TRF-1026X-14-1
Polymer Name:
Polypropylene (unspecified)
Processing Methods:
Injection Molding
Takaroku Shoji TRF-1026X-14-1 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Smiths Metal Centres
Smiths Metal Centres Polycarbonate (PC)
Polymer Name:
Polycarbonate (PC)
Physical Form:
Bars, Sheets, Rods
Features:
Good Impact Strength, Recyclable, Heat Resistance, Electrically Insulating, Good Machinability, Dimensional Stability
Density:
1200.0 - 1200.0 kg/m³
Color:
Transparent
Smiths Metal Centers Polycarbonate (PC) is supplied as a machine grade which is well suited for a variety of application which requires high impact strength. It is an amorphous transparent material which benefits from a combination of good mechanical and electrical properties. The material is readily recyclable and benefits from good machinability and can be machined to close working tolerances.
Nanocyl
PLASTICYL™ PEEK1001
Functions:
Conductive Agent
Processing Methods:
Injection Molding, Extrusion
Carrier:
Resin-based, Polyether Ether Ketone (PEEK)
PLASTICYL™ PEEK1001 is a conductive masterbatch based on Poly Ether Ether Ketone (PEEK) loaded with 10% of Nanocyl’s MWCNTs (NC7000™). Because of its low viscosity and high flow, PLASTICYL™ PEEK1001 is ideal for injection molding and extrusion processes.
Sugo Plas
Sugo Plas ESD B2405
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Extrusion, Injection Molding
Fillers Included:
Carbon Powder
ESD B2405 belongs to ESD Polyamide Series with Anti-static, High mechanical strength, Static dissipative and Good toughness.
Takaroku Shoji
Takaroku Shoji TRF-PS02-21
Polymer Name:
Polystyrene (unspecified)
Processing Methods:
Injection Molding
Takaroku Shoji TRF-PS02-21 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Takaroku Shoji
Takaroku Shoji TRF-PC-PC10
Polymer Name:
Polycarbonate (PC)
Processing Methods:
Injection Molding
Flexural Modulus:
3000.0 - 3000.0 MPa
Takaroku Shoji TRF-PC-PC10 is our unique filler dispersion and blending technology, excellent electrical conductivity performance can be imparted to various thermoplastic resins.
Momentive Performance Materials
Silopren™ Gel TP3636
Applications:
Jacketing & Insulation, Potting Compounds, Consumer Electronics
Product Families:
Silicone Elastomers, Specialty Elastomers
Chemical Family:
Silicones
Polymer Name:
Silicone Elastomer
End Uses:
Insulators, Encapsulant, Cell Phones
Silopren™ Gel TP 3636 is a solvent-free, low-viscosity roomtemperature vulcanizing two-component silicone rubber, which crosslinks into a gel-like product by an addition reaction caused by mixing components A and B. The resulting gel is transparent and dimensionally stable and adheres to virtually all substrates. With its good electrical insulation capacity Silopren™ Gel TP 3636 can be used, for example, to protect electronic components. The silicone gel protects sensitive components from moisture and through its good mechanical damping properties from shocks and shaking. The silicone gel retains these properties over a wide temperature range.Key Features and Benefits solvent-free, low viscosity, room-temperature vulcanizing transparent and dimensionally stable good electrical insulation retains these properties over a wide temperature range.