Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- Ultra low modulus
- Thermal stability
- Hydrophobic
- Adhesion to metals
- High adhesion to various substrates
- Flexibilizer
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Markets
- Compatible Substrates & Surfaces
- RECOMMENDED FORMULATION USE
PEAM-1769 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. The oligomer has good solubility in both aliphatic and aromatic solvents and monomers.
Properties
- Physical Form
- Appearance
- Amber liquid
- Typical Properties
Value | Units | Test Method / Conditions | |
Viscosity at 25°C (typical) | 20000 | cP | Haake Rheometer |
Functionality | 2 | - | - |
Molecular Weight | 1769 | daltons | - |
Weight Loss at 300°C | max.3.0 | % | TGA |
Decomposition Temperature | min. 375 | °C | TGA |
Recommended Storage Temp | 10°C or below | - | - |
Recommended Storage Temperature | 10 or Below | °C | - |
Glass Transition Temperature (cured with 2% Dicumyl Peroxide) | -40 (-10) | °C | TMA (DMA) |
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide) | α1 110 (α2 250) | ppm/°C | TMA |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C | 1300 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C | 48 | MPa | Rheometrics Rheometer |
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C | 1 | MPa | Rheometrics Rheometer |